The Influence of Pad Thermal Diffusivity over Heat Transfer into the PCBs Structure

The Pads have unique values of thermophysical properties (THP) having important contribution over heat transfer into the PCB structure. Materials with high thermal diffusivity (TD) rapidly adjust their temperature to that of their surroundings, because the HT is quick in compare to their volumetric heat capacity (VHC). In the paper is presenting the diffusivity tests (ASTM E1461 flash method) for PCBs with different core materials. In the experiments, the multilayer structure of PCBA was taken into consideration, an equivalent property referring to each of experimental structure be practically measured. Concerning to entire structure, the THP emphasize the major contribution of substrate in establishing of reflow soldering process (RSP) heat transfer necessities. This conclusion offer practical solution for heat transfer time constant calculation as function of thickness and substrate material diffusivity with an acceptable error estimation. Keywords—heat transfer time constant, packaging, reflow soldering process, thermal diffusivity.